Infrared and Laser Engineering, Volume. 51, Issue 5, 20210303(2022)

Prediction analysis of subsurface damage of work-part ZnS in fixed abrasive lapping

Yufei Zhang... Zikun Wang, Weidong Hu, Fengli Niu and Yongwei Zhu |Show fewer author(s)
Author Affiliations
  • College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
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    Figures & Tables(14)
    DEM model for fixed abrasive lapping
    Polished workpiece
    Schematic diagram of angle polishing
    (a) Profile curve of polished slope; (b) Curve after fitting
    Simulation results of subsurface microcracks with different particle sizes: (a) W5; (b) W15; (c) W25; (d) W30
    Subsurface microcracks at different depths after W25 abrasive grain processing: (a) 0 μm; (b) 2.30 μm; (c) 3.04 μm; (d) 3.57 μm; (c) 4.39 μm; (d) 6.27 μm
    Microscopic observation of microcrack end point: (a) W5; (b) W15; (c) W30
    Schematic diagram of subsurface damage during grinding
    Comparison of simulated and measured depth of microcrack layer
    • Table 1. Actual value and two-dimensional model value of material property parameters

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      Table 1. Actual value and two-dimensional model value of material property parameters

      $E/{\rm{GPa}}$υ$ {\sigma }_{b}/{\rm{MPa} } $$ {\sigma }_{bb}/{\rm{MPa } } $
      Actual parameters85.50.2750.0103.0
      Model parameter89.20.2849.1110.5
    • Table 2. Preparation parameters of consolidated abrasive pad

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      Table 2. Preparation parameters of consolidated abrasive pad

      $ \eta $$ {\lambda }_{0} $${E}^{\mathrm{*} }/{\rm{GPa }}$
      0.120.441.085
    • Table 3. Average cutting depth corresponding to different diamond particle sizes

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      Table 3. Average cutting depth corresponding to different diamond particle sizes

      Particle size/μmAverage cutting depth/nm
      598.2
      15294.7
      25491.1
      30589.3
    • Table 4. Processing parameters of Zinc sulfide

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      Table 4. Processing parameters of Zinc sulfide

      Load/ kPa Rotate speed of pad/r·min−1Rotate speed of workpiece/r·min−1Lapping time/ min
      2085803
    • Table 5. Process parameters of angle polishing

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      Table 5. Process parameters of angle polishing

      Polishing padPolyurethaneFlannelette
      Pressure/kPa1010
      Rotate speed of pad/r·min−18585
      Rotate speed of workpiece/r·min−18080
      Polishing time/min1040
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    Yufei Zhang, Zikun Wang, Weidong Hu, Fengli Niu, Yongwei Zhu. Prediction analysis of subsurface damage of work-part ZnS in fixed abrasive lapping[J]. Infrared and Laser Engineering, 2022, 51(5): 20210303

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    Paper Information

    Category: Optical devices

    Received: Dec. 25, 2021

    Accepted: --

    Published Online: Jun. 14, 2022

    The Author Email:

    DOI:10.3788/IRLA20210303

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