Spectroscopy and Spectral Analysis, Volume. 33, Issue 3, 647(2013)

The Curing Behavior of Two Thermoset Resins Containing Silicon Alkynyl Group

SHI Song1,*... KONG Lei2, QI Hui-min3 and ZHANG Da-hai2 |Show fewer author(s)
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  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
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    References(9)

    [1] [1] Itoh M, Mitsuzuka M, Iwata K, et al. Macromolecules, 1994, 27: 7917.

    [2] [2] Itoh M, Inoue K, Iwata K. Advanced Materials, 1997, 9: 1187.

    [3] [3] Itoh M, Inoue K, Iwata K, et al. Macromolecules, 1997, 30: 694.

    [4] [4] Itoh M, Iwata K, Ishikawa J I, et al. Journal of Polymer Science Part a-Polymer Chemistry, 2001, 39: 2658.

    [5] [5] Kuroki S, Ishikawa J, Itoh M. Macromolecules, 1998, 31: 2804.

    [6] [6] Itoh M, Inoue K, Hirayama N, et al. Journal of Material Science, 2002, 37: 3795.

    [7] [7] Ogasawara T, Ishikawa T, Yamada T, et al. Journal of Composite Materials, 2002, 36: 143.

    [11] [11] Ye Li, Han WeiJiang, Zhang Ruilin, et al. Journal of Applied Polymer Science, 2008, 110: 4064.

    [13] [13] Krevelen D W, Nijenhuis K T. Properties of Polymers. Elsevier, 2009.

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    SHI Song, KONG Lei, QI Hui-min, ZHANG Da-hai. The Curing Behavior of Two Thermoset Resins Containing Silicon Alkynyl Group[J]. Spectroscopy and Spectral Analysis, 2013, 33(3): 647

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    Paper Information

    Received: Aug. 14, 2012

    Accepted: --

    Published Online: Mar. 27, 2013

    The Author Email: Song SHI (shis1971@163.com)

    DOI:10.3964/j.issn.1000-0593(2013)03-0647-06

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