Infrared and Laser Engineering, Volume. 45, Issue 9, 904003(2016)

320×256 LW IRFPA ROIC with large charge capacity

Zhai Yongcheng1,2、* and Ding Ruijun1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    References(9)

    [1] [1] Liu Liping. Status and trend of the readout circuit technology for IRFPA[J]. Laser & Infrared, 2007, 37(7): 598-600. (in Chinese)

    [2] [2] Donald A Reago, Stuart Horn, James Campbell, et al. Third generation imaging sensor system concepts[C]//SPIE, Infrared Imaging Systems: Design, Analysis, Modeling and Testing X, 1999, 3701:108-117.

    [3] [3] Paul Norton, James Campbell, Stuart Horn, et al. Third-generation infrared imagers[C]//SPIE, 2000, 4130: 226-236.

    [4] [4] He Li, Yang Dingjiang, Ni Guoqiang, et al. Introduction to Advanced Focal Plane Arrays[M]. Beijing: National Defense Industry Press, 2011. (in Chinese)

    [7] [7] Liao Jun. Design of front-end readout circuit for cryogenic infrared focal plane array[D]. Tianjin: Tianjin University, 2012. (in Chinese)

    [8] [8] Behzad Razavi. Design of Analog CMOS Integrated Circuits[M]. Xi′an: Xi′an Jiaotong University Press, 2002.

    [9] [9] Wang Pan. CTIA input stage design of short-wavelength staring IRFPAs ROIC[J]. Laser & Infrared, 2013, 43(12): 1363-1367. (in Chinese)

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    Zhai Yongcheng, Ding Ruijun. 320×256 LW IRFPA ROIC with large charge capacity[J]. Infrared and Laser Engineering, 2016, 45(9): 904003

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    Paper Information

    Category: 红外技术及应用

    Received: Jan. 10, 2016

    Accepted: Feb. 15, 2016

    Published Online: Nov. 14, 2016

    The Author Email: Yongcheng Zhai (zhaiyongcheng@126.com)

    DOI:10.3788/irla201645.0904003

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