Infrared and Laser Engineering, Volume. 51, Issue 9, 20220079(2022)

Study on large-area array SW HgCdTe infrared focal plane device

Xiaodan Gong, Hongfu Li, Chaowei Yang, Shouzhang Yuan, Yuanqing Feng, Yuanjin Huang, Xu Hu*, and Lihua Li*
Author Affiliations
  • Kunming Institute of Physics, Kunming 650223, China
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    With the development of infrared focal plane technology, large-area infrared focal plane devices have been widely used in remote sensing, meteorology, resource surveys and high-resolution earth observation satellites. Therefore, based on the third-generation infrared focal plane technology ultra-large-scale focal plane devices are called research hotspots at home and abroad. The short wave (SW) 2 k (18 μm, pixel pitch) mercury cadmium telluride(MCT) infrared focal plane device was reported, which was successfully developed by Kunming Institute of Physics using n-on-p technology. The SW 2 k MCT infrared focal plane device has broken through the preparation of large-size cadmium zinc telluride (CdZnTe) substrates and the growth of large-area liquid phase epitaxy thin film materials. The substrate size was increased from Φ75 mm to Φ90 mm, and a highly uniform large-area Mercury Cadmium Telluride (HgCdTe) thin film material was obtained. By tackling key technologies such as large array device technology and large area array flip-chip interconnect, a high-performance SW 2 k×2 k (18 μm) MCT infrared focal plane device with an operability over 99.9%, average peak detection rate (D*) greater than 4×1012 (cm·Hz1/2)/W and dark current density of 1 nA/cm2 was finally obtained.

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    Xiaodan Gong, Hongfu Li, Chaowei Yang, Shouzhang Yuan, Yuanqing Feng, Yuanjin Huang, Xu Hu, Lihua Li. Study on large-area array SW HgCdTe infrared focal plane device[J]. Infrared and Laser Engineering, 2022, 51(9): 20220079

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    Paper Information

    Category: Infrared technology and application

    Received: Jan. 29, 2022

    Accepted: --

    Published Online: Jan. 6, 2023

    The Author Email: Hu Xu (huxu_kip_norinco@outlook.com), Li Lihua (llh_email@163.com)

    DOI:10.3788/IRLA20220079

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