Acta Photonica Sinica, Volume. 41, Issue 2, 240(2012)

High Frequency Analysis of TO Packaging for High-speed Avalanche Photodetectors

XU Guang-hui1、*, CHAI Guang-yue1, PENG Jin-hua2, HUANG Chang-tong1, DUAN Zi-gang1, and TAN Ke-min3
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  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
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    Based on the frequency response model,high frequency characteristic analysis for the TO packaged avalanche photodetectors is presented.The influence on frequency performance of TO packaging,including chip,bondwire,transimpedance amplifer,and TO header elements are investigated.By changing inductance parameters induced by different bandwires,the different frequency responses are observed.Finally,by considering the engineering conditions,a -3 dB bandwidth of 10GHz is optimally obtained for TO packaging.

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    XU Guang-hui, CHAI Guang-yue, PENG Jin-hua, HUANG Chang-tong, DUAN Zi-gang, TAN Ke-min. High Frequency Analysis of TO Packaging for High-speed Avalanche Photodetectors[J]. Acta Photonica Sinica, 2012, 41(2): 240

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    Paper Information

    Received: Sep. 16, 2011

    Accepted: --

    Published Online: Mar. 9, 2012

    The Author Email: Guang-hui XU (ghxu06@126.com)

    DOI:10.3788/gzxb20124102.0240

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