With the aim of overcoming the limitations of traditional circuit-board integration methods, a copper-clad board-line forming technology based on femtosecond laser is proposed. Single-factor and orthogonal experiments are performed on a copper-clad laminate using femtosecond laser. Among influencing factors such as laser power, frequency, scanning speed, number of scans, and defocusing amount, the number of scans has the largest influence on the etching depth and surface roughness, while the laser frequency has the smallest influence on both. By etching the copper-clad laminate with optimized laser parameters, the surface copper layer can be removed completely to obtain a high-quality etched region without damaging the substrate underneath.