Infrared and Laser Engineering, Volume. 49, Issue S1, 20200096(2020)

Design of high-speed imaging circuit of spaceborne LASIS hyperspectral imager

Liu Yongzheng*, Kong Liang, Liu Xuebin, Chen Xiaolai, Liu Wenlong, and Zhang Xin
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    According to the requirement of high resolution and wide range for hyperspectral imaging in the field of remote sensing, a high-speed spectral imager electronic system with high resolution and high reliability was developed, which was suitable for the application of Large Aperture Interferential Imaging Spectrometer(LASIS). The multiple four channel parallel ADC chips for analog-to-digital conversion was used, with V5 series FPGA as the core processor and high-speed SerDes chip for image data transmission. At last, the imaging performance and reliability of our high-speed imaging circuit were validated. All these measures provide technical support for China to enter the leading position in the field of space remote sensing, and also provide useful reference for further development of high-resolution hyperspectral imaging remote sensing.

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    Liu Yongzheng, Kong Liang, Liu Xuebin, Chen Xiaolai, Liu Wenlong, Zhang Xin. Design of high-speed imaging circuit of spaceborne LASIS hyperspectral imager[J]. Infrared and Laser Engineering, 2020, 49(S1): 20200096

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    Paper Information

    Category: 图像处理

    Received: Apr. 5, 2020

    Accepted: May. 6, 2020

    Published Online: Feb. 5, 2021

    The Author Email: Yongzheng Liu (liuyongzheng@opt.ac.cn)

    DOI:10.3788/irla20200096

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