Infrared and Laser Engineering, Volume. 50, Issue 6, 20200513(2021)
Miniaturized and highly integrated broadband optical transceiver assembly
At present, the volume and cost of discrete photonic devices severely restrict the application of microwave photonic technology in radar systems. Limited by the current integration capabilities and material systems, microwave photonic monolithic integrated chip is difficult to realize in a short time. Aiming at the urgent need for highly integrated microwave photonic devices in application scenarios such as radar, a new type of miniaturized and highly integrated broadband optical transceiver module was developed. The module adoped optoelectronic heterogeneous integrated packaging technology, which highly integrated MZM modulator chip, microwave chip, detector chip, optical circulator and wavelength division multiplexer. The size of a single module was only 85 mm×35 mm×10 mm, which was equivalent to the volume of a single MZM modulator. At the same time, its performance was comparable to the traditional discrete components. In the 6-18 GHz range, the component could achieve flatness of ±1.5 dB, gains of more than 18 dB in the uplink, and could achieve gains of more than -1 dB in the downlink and the link noise figure was less than 30 dB. The planarization and miniaturization design makes it can be used in phased array radar, electronic warfare and other application scenarios, and it has broad application prospects.
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Maoxu Wang, You Yu, Zhenhua Tang, Yongchuan Xiao, Chao Wang, Hui Gao. Miniaturized and highly integrated broadband optical transceiver assembly[J]. Infrared and Laser Engineering, 2021, 50(6): 20200513
Category: Optical devices
Received: Dec. 26, 2020
Accepted: --
Published Online: Aug. 19, 2021
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