Frontiers of Optoelectronics, Volume. 3, Issue 2, 139(2010)
Nano materials for microelectronic and photonic packaging
This paper addresses the state-of-the-art nanoscience and technology regarding next generation high density microelectronics and photonics packaging applications, including carbon nanotubes (CNTs) for electrical/thermal devices, and molecular wires for electrical interconnects, etc.
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Ching-Ping WONG, Wei LIN, Ling-Bo ZHU, Hong-Jin JIANG, Rong-Wei ZHANG, Yi LI, Kyoung-Sik MOON. Nano materials for microelectronic and photonic packaging[J]. Frontiers of Optoelectronics, 2010, 3(2): 139
Received: Jul. 30, 2009
Accepted: Oct. 23, 2009
Published Online: Sep. 20, 2012
The Author Email: WONG Ching-Ping (cp.wong@mse.gatech.edu)