Laser & Optoelectronics Progress, Volume. 48, Issue 7, 70602(2011)

Application of Thermal Analysis on Reliability Design of Optoelectronic Modules

Song Beili1,2、*, Yang Dian1,2, Zhao Xianming1,2, and Xu Hongchun1,2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • show less

    Components of counting method is the general method of the reliability design of optoelectronic modules at home and abroad. In order to improve the problem that no mature optoelectronic modules the reliability prediction can not be effectively carried out, in product design stage by using Flow Simulation softwar, and working status of XFP (10G small form factor pluggable) module, for example, is simulation analyzed under different temperature conditions. The thermal analysis of XFP module is finished, and the optimization approach of the reliability design of XFP module is given. Then the specifically quantified of the reliability prediction of XFP module and is expected, the quantitative analysis of reliability for optoelectronic modules in the design phase is achieved.

    Tools

    Get Citation

    Copy Citation Text

    Song Beili, Yang Dian, Zhao Xianming, Xu Hongchun. Application of Thermal Analysis on Reliability Design of Optoelectronic Modules[J]. Laser & Optoelectronics Progress, 2011, 48(7): 70602

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: Fiber Optics and Optical Communications

    Received: Dec. 13, 2010

    Accepted: --

    Published Online: Jun. 3, 2011

    The Author Email: Beili Song (blsong@wtd.com.cn)

    DOI:10.3788/lop48.070602

    Topics