Opto-Electronic Engineering, Volume. 51, Issue 10, 240164(2024)

Dual-layer 3D terahertz metamaterial based multifunctional sensor

Guangsheng Deng1...2, Aoran Guo2, Xinqi Cheng2, Jun Yang1,2 and Fei Cai1,* |Show fewer author(s)
Author Affiliations
  • 1Special Display and Imaging Technology Innovation Center of Anhui Province,Academy of Opto-Electronic Technology,Hefei University of Technology,Hefei,Anhui 230009,China
  • 2Anhui Province Key Laboratory of Measuring Theory and Precision Instrument,School of Instrument Science and Optoelectronics Engineering,Hefei University of Technology,Hefei,Anhui 230009,China
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    The versatility of sensors,as a crucial part of integrated devices,is receiving increasing attention. Here,a terahertz metamaterial multifunctional sensor based on the coupling of a two-layer 3D resonant structure is introduced. The sensor consists of an upper and lower polyimide film substrate,a graphite layer attached to the lower polyimide film substrate,and a periodic double-layer 3D toothed coupling resonant structure between the graphite layer and the upper polyimide film substrate,which consists of a symmetric mountain-shaped structure in the lower layer and a symmetric concave structure in the upper layer. The three-dimensional metamaterial can achieve multifunctional measurements: the refractive index change of the liquid medium can be detected with high sensitivity by measuring the resonant frequency of the structure. Therefore,it is possible to detect the liquid medium with such a design. Meanwhile,in terms of micro displacement sensing,a high micro displacement measurement sensitivity can be realized in both the z-axis and y-axis directions,respectively. The 3D metamaterial sensor proposed in this paper provides an idea for the design of a functionally integrated sensor in the terahertz region.

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    Guangsheng Deng, Aoran Guo, Xinqi Cheng, Jun Yang, Fei Cai. Dual-layer 3D terahertz metamaterial based multifunctional sensor[J]. Opto-Electronic Engineering, 2024, 51(10): 240164

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    Paper Information

    Category: Article

    Received: Jul. 12, 2024

    Accepted: Sep. 30, 2024

    Published Online: Jan. 2, 2025

    The Author Email: Cai Fei (蔡斐)

    DOI:10.12086/oee.2024.240164

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