Laser & Optoelectronics Progress, Volume. 61, Issue 5, 0523002(2024)

AlGaN-Based Deep-UV LED with Novel Transparent Electrodes and Integrated Array Device for Efficient Disinfection

Zefeng Lin1, Lucheng Yu1, Qicheng Zhou1, Yehang Cai1, Fawen Su3, Shengrong Huang3, Feiya Xu1, Xiaohong Chen1, Ling Li2, and Duanjun Cai1、*
Author Affiliations
  • 1Fujian Key Laboratory of Semiconductor Materials and Applications, College of Physical Science and Technology, Xiamen University, Xiamen 361005, Fujian , China
  • 2State Key Laboratory of Marine Environmental Science, College of Ocean and Earth Sciences, Xiamen University, Xiamen 361102, Fujian , China
  • 3Xiamen Yaoguang Semiconductor Technology Co. Ltd., Xiamen 361006, Fujian , China
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    The COVID-19 pandemic since 2019 has brought huge impacts and economic losses to the world. AlGaN-based deep-ultraviolet light emitting diode (DUV-LED) as a new and efficient sterilization device has attracted broad research attentions. The transparent electrode covering deep-UV band plays an important role in improving the performance of deep-UV LEDs. Here, we propose a novel core-shell structure Cu@metal nanosilks (Cu@metal NSs) network electrode with high transparency (>90%) to enhance the output power of deep-UV LED. In addition, based on the optimized design of integrated array module of deep-UV LEDs, a 180 mW DUV-LED sterilization device is fabricated. The device shows high inactivation performance for Escherichia coli and Staphylococcus aureus (>99.99%) and for COVID-19 virus (>99.9%). This work provides a novel method for improving the performance of deep-UV LEDs and pushing forward the efficient sterilization applications.

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    Zefeng Lin, Lucheng Yu, Qicheng Zhou, Yehang Cai, Fawen Su, Shengrong Huang, Feiya Xu, Xiaohong Chen, Ling Li, Duanjun Cai. AlGaN-Based Deep-UV LED with Novel Transparent Electrodes and Integrated Array Device for Efficient Disinfection[J]. Laser & Optoelectronics Progress, 2024, 61(5): 0523002

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    Paper Information

    Category: Optical Devices

    Received: Mar. 20, 2023

    Accepted: Apr. 27, 2023

    Published Online: Mar. 5, 2024

    The Author Email: Cai Duanjun (dcai@xmu.edu.cn)

    DOI:10.3788/LOP230904

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