Driven by the demand of electronic equipment miniaturization, modularization and intelligence for artificial intelligence, aerospace and defense weapons, revolutionary breakthroughs have been made in microsystem packaging technology design and critical process. Novel system level packaging technologies allow integrated devices to work together and communicate at very high speeds. With the full integration of the package and wafer process, the packaging reliability and efficiency have been greatly improved, and the parasitic is significantly reduced. In this paper, the structures and types of microsystem packaging were summarized. The realization method and critical technology of high reliable wafe-level package, ball grid array (BGA) package, system in package (SIP), three-dimensional(3D) stacked packaging and TSV process were discussed, and the developing trends were given.