Journal of Radiation Research and Radiation Processing, Volume. 43, Issue 1, 010402(2025)

Effect of dielectric barrier discharge plasma on seed germination of Lycium barbarum

Junfeng RONG*, Jiali ZHU, Chengyuan ZHANG, Binbin ZHAO, and Minggong CHEN
Author Affiliations
  • School of Chemical and Blasting Engineering, Anhui University of Science and Technology, Huainan 232001, China
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    The germination-promoting effects of low-temperature plasma produced by dielectric barrier discharge on Lycium barbarum (L. barbarum) seeds and the optimal treatment process were investigated using a pin-plate dielectric barrier discharge plasma reactor. The distance between the fixed needle plate electrode and the sample liquid was 5 mm. The effects of dielectric barrier discharge plasma on L. barbarum seed germination were investigated at different discharge times, discharge voltages, and electrolyte types. In this single-factor experiment, the response surface was used to optimize a seed treatment protocol for L. barbarum, and the effect of dielectric barrier discharge plasma on seed coat structure and properties was investigated by observing seed coat morphology and measuring the contact angle. Under discharge conditions including a discharge time of 1 h, a 35 kV discharge voltage, and 150 mL of 0.2% aqueous Na2SO4, the germination rate of treated L. barbarum seeds was 86.67%, and that of untreated seeds was 33.33%, an increase of 53.34%. The treated seed vitality index was 600.58, and that of untreated seeds was 206.9, revealing an increase of 65.55%. After treatment, the seed coat became smooth, its texture was rough, and seed hydrophilicity was enhanced. This study provides a clean and efficient method to improve plant seed germination rates.

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    Junfeng RONG, Jiali ZHU, Chengyuan ZHANG, Binbin ZHAO, Minggong CHEN. Effect of dielectric barrier discharge plasma on seed germination of Lycium barbarum[J]. Journal of Radiation Research and Radiation Processing, 2025, 43(1): 010402

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    Paper Information

    Category: RADIATION TECHNOLOGY APPLICATION

    Received: Jun. 12, 2024

    Accepted: Jul. 9, 2024

    Published Online: Mar. 13, 2025

    The Author Email: RONG Junfeng (13695610310@163.com)

    DOI:10.11889/j.1000-3436.2024-0050

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