Laser & Optoelectronics Progress, Volume. 49, Issue 11, 111201(2012)

Three-Dimensional Deformation Measurement with the Combination of DSCM and ESPI

Sun Mingyong*, Cai Kang, Yang Deyu, and Sun Ping
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  • [in Chinese]
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    Based on an electronic speckle pattern interferometry (ESPI) optical setup with one illuminating light sensitive to out-of-plane displacement, a method is presented for three-dimensional deformation measurement by using the combination of digital speckle correlation method (DSCM) and ESPI. One speckle pattern before deformation is captured by a CCD camera without a reference light. The reference light is used and an ESPI system is constructed. The out-plane displacement component can be measured after the test object is deformed by using phase shifting technique in the ESPI system. Another speckle pattern is captured without reference light after deformation. The in-plane displacement components can be obtained by using DSCM from the two speckle patterns, one obtained before deformation and another after deformation. In this way the measurement of the three-dimensional displacement of an object is completed. A typical three-point-bending beam experiment is carried out by the method proposed. Experimental results show that the three displacement components can be obtained effectively. The deformation measurement system is simple and useful for it has a simple setup and easy operation.

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    Sun Mingyong, Cai Kang, Yang Deyu, Sun Ping. Three-Dimensional Deformation Measurement with the Combination of DSCM and ESPI[J]. Laser & Optoelectronics Progress, 2012, 49(11): 111201

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    Paper Information

    Category: Instrumentation, Measurement and Metrology

    Received: Jul. 4, 2012

    Accepted: --

    Published Online: Sep. 14, 2012

    The Author Email: Mingyong Sun (sunmy126@126.com)

    DOI:10.3788/lop49.111201

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