Laser & Optoelectronics Progress, Volume. 61, Issue 7, 0706008(2024)

Development Status and Trend of Board-Level Photoelectric Interconnection Technology

Yaohui Du and Xia Hou*
Author Affiliations
  • Space Laser Engineering Department, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China
  • show less

    Photoelectric interconnection technology has distinct advantages in military fields, such as photoelectric communication and navigation, high-performance processors, and civil communication. The demand for higher bandwidth continues to increase for the current high-performance computing and high-rate communication systems, whether it is board-to-board or the link between modules on the board. Photoelectric interconnection can be used to alleviate this issue, and reduce the system costs and power consumption, allowing the system to be downsized and high-performing. Optical interconnection technology is classified into three types based on the optical transmission medium: free-space optical interconnection technology, polymer optical waveguide optical interconnection technology, and optical fiber optical interconnection technology. The definition and three types of photoelectric interconnection are introduced briefly, and the development trends of polymer optical guide photoelectric interconnection and optical fiber photoelectric interconnection at home and abroad are expounded. After weighing the benefits and drawbacks of the three types of photoelectric interconnection, the key technology and development trends in this field are identified. It serves as a reference for future research directions in this field.

    Tools

    Get Citation

    Copy Citation Text

    Yaohui Du, Xia Hou. Development Status and Trend of Board-Level Photoelectric Interconnection Technology[J]. Laser & Optoelectronics Progress, 2024, 61(7): 0706008

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: Fiber Optics and Optical Communications

    Received: Mar. 3, 2023

    Accepted: May. 19, 2023

    Published Online: Apr. 18, 2024

    The Author Email: Hou Xia (hou_xia@siom.ac.cn)

    DOI:10.3788/LOP230766

    Topics