Microelectronics, Volume. 52, Issue 5, 843(2022)

Research on Preventing Solder Joint Cracking Technology of SOD-323 Device

JIANG Dongyi... ZHANG Chunya and HUANG Ji |Show fewer author(s)
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    For the problem of solder joint cracking in the environmental test of the SOD-323 double-end device in a power supply product, the mechanism of solder joint cracking was studied. Combining with the temperature characteristics of Three-proofing Lacquer, simulation and stress tests under various conditions were carried out. According to the test results, the reliability application solution for the SOD-323 double-end device is proposed.

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    JIANG Dongyi, ZHANG Chunya, HUANG Ji. Research on Preventing Solder Joint Cracking Technology of SOD-323 Device[J]. Microelectronics, 2022, 52(5): 843

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    Paper Information

    Special Issue:

    Received: Sep. 5, 2022

    Accepted: --

    Published Online: Jan. 18, 2023

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.220329

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