Anodic alumina formed by electrochemical oxidation has a fine structure with a nanohole array. Cu is implanted into the pores of anodic alumina by means of electroplating. With such metallic array, the alumina film exhibits polarization properties like a wire grid polarizer. At the wavelength of 1.5 μm, the film embedded manifests higher transmissivity and better extinction ratio. The dependence of the polarization properties on anodization and electroplating conditions is also studied. To a certain extent, the extinction is enhancing with the increase of anodic oxidation voltage. With the electroplating current density growing, the polarization property is also increasing because of the growth of metallic columns, but the trend is stopped when the current density is too high to make the Joule heat exhale as quickly as possible and result in the irregularity of the columns. The simple microprocessing techniques, the low cost and the small bulk make the film embedded Cu extensive prospects in optical telecommunication.