Chinese Journal of Quantum Electronics, Volume. 39, Issue 6, 942(2022)

Research progress of optical fiber integrated photodetectors

Weidong CHEN1、*, Linqing ZHUO2, Wenguo ZHU1, Huadan ZHENG3, Yongchun ZHONG4, Jieyuan TANG1,3, Yi XIAO1, Mengyuan XIE4, Jun ZHANG1, Jianhui YU1, and Zhe CHEN3,4
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
  • 4[in Chinese]
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    Nowadays, optoelectronic devices are developing towards miniaturization and integration. However, traditional optoelectronic devices are usually based on silicon wafer technology or waveguide technology, which makes the chip need to be coupled with optical fiber pigtail through waveguide mode converter. Therefore, it is of great practical significance to develop optoelectronic devices compatible with optical fiber system. The development of “optical fiber laboratory” technology promotes the combination of low-dimensional materials and optical fibers, as well as the integration and development of photonic chips on optical fibers, and is helpful for developing a new generation of miniaturized, integrated, lightweight, low-cost, and multi-functional all fiber photonic integration platform. According to the different interaction modes of light and matter, optical fiber integrated photodetectors can be divided into two types: along waveguide integration and optical fiber end integration. This paper mainly reviews the fabrication methods and research progress of these two types of optical fiber integrated photodetectors in recent years, and prospects the future development of optical fiber as an integrated platform for optoelectronic devices.

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    CHEN Weidong, ZHUO Linqing, ZHU Wenguo, ZHENG Huadan, ZHONG Yongchun, TANG Jieyuan, XIAO Yi, XIE Mengyuan, ZHANG Jun, YU Jianhui, CHEN Zhe. Research progress of optical fiber integrated photodetectors[J]. Chinese Journal of Quantum Electronics, 2022, 39(6): 942

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    Paper Information

    Received: Jul. 6, 2022

    Accepted: --

    Published Online: Mar. 5, 2023

    The Author Email: Weidong CHEN (We11doneChen@163.com)

    DOI:10.3969/j.issn.1007-5461.2022.06.008

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