High Power Laser and Particle Beams, Volume. 33, Issue 9, 091002(2021)

Low-stress mounting technology of large aperture mirror

Shengheng Zheng1... Wenjing Ma1, Ying Yang1,*, Tingfen Cao1, Xiaojuan Chen2, Yuyuan Guo1, Yuzhen Liao1, Xin Zhang1, Wei Han1, Xuewei Deng1 and Dongxia Hu1 |Show fewer author(s)
Author Affiliations
  • 1Research Center of Laser Fusion, CAEP, P. O. Box 919-988, Mianyang 621900, China
  • 2Institute of Systems Engineering, CAEP, P. O. Box 919-408, Mianyang 621900, China
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    The high-power solid-state laser facility puts forward stringent requirements for the additional wavefront distortion and attitude stability of the large-aperture mirror. While ensuring attitude stability, the peak-to-valley (PV) value of additional wavefront distortion caused by low-stress mounting is required to be less than λ/3 (wavelength λ=633 nm). In this paper, a mounting technology of large aperture mirror with three-point front support and eight point side fixing is proposed. The additional wavefront distortion caused by the mounting structure is simulated and experimentally studied. And the attitude stability of mirror under different working conditions is experimentally researched. The results show that the PV value of additional wavefront distortion introduced by this mounting method is about 23.6 nm, and the PV value of the mirror pointing under different conditions of vibration, shaking, and flipping is less than 50 μrad. The additional wavefront distortion and attitude stability meet the requirements of high-power lasers.

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    Shengheng Zheng, Wenjing Ma, Ying Yang, Tingfen Cao, Xiaojuan Chen, Yuyuan Guo, Yuzhen Liao, Xin Zhang, Wei Han, Xuewei Deng, Dongxia Hu. Low-stress mounting technology of large aperture mirror[J]. High Power Laser and Particle Beams, 2021, 33(9): 091002

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    Paper Information

    Category: High Power Laser Physics and Technology

    Received: May. 10, 2020

    Accepted: --

    Published Online: Oct. 9, 2021

    The Author Email: Yang Ying (whbms4353@163.com)

    DOI:10.11884/HPLPB202133.210176

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