Laser & Optoelectronics Progress, Volume. 59, Issue 24, 2410010(2022)

Intelligent Identification of Clastic Rock Outcrops from Multimodal UAV Images

Yanfang Yan1, Qing Wang1、*, Qihong Zeng2, Yanlin Shao1, Wei Wei1, and Changmin Zhang1
Author Affiliations
  • 1School of Geosciences, Yangtze University, Wuhan 430100, Hubei, China
  • 2China Institute of Petroleum Exploration and Development, Beijing 100083, China
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    Field outcrops are affected by natural conditions, and the outcrop surfaces are covered with vegetation and severely weathering, which makes the traditional lithology image recognition methods more challenging to implement. Combining artificial intelligence for rock image recognition lithology in the geological field has become an unavoidable trend with the advent of geological big data and the rising demand for intelligent geology. In this study, we propose SE-DeepLabv3+, an intelligent lithology recognition approach for multimodal clastic rock outcrop images based on an attention mechanism. The SE-DeepLabv3+ achieves more than 90% accuracy in lithology recognition when compared to classical classification methods and semantic segmentation methods, with hand annotation results as a reference, which is greater than other methods. For lithology identification, the SE-DeepLabv3+ was used on certain outcrop sections of the Qingshuihe-Karaza Formation along the southern boundary of the Junggar Basin in Xinjiang, and better identification results were obtained. The study employs UAV 3D image data, combined with artificial intelligence technology to identify the lithology of clastic outcrops, which can significantly enhance the efficiency of lithology identification, transform the conventional operation mode, and advance geological research toward quantification and intelligence.

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    Yanfang Yan, Qing Wang, Qihong Zeng, Yanlin Shao, Wei Wei, Changmin Zhang. Intelligent Identification of Clastic Rock Outcrops from Multimodal UAV Images[J]. Laser & Optoelectronics Progress, 2022, 59(24): 2410010

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    Paper Information

    Category: Image Processing

    Received: Sep. 7, 2022

    Accepted: Oct. 24, 2022

    Published Online: Nov. 30, 2022

    The Author Email: Wang Qing (571779719@qq.com)

    DOI:10.3788/LOP202259.2410010

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