As the thermal noise and dark-currents caused by the temperature increment of CCD components will degrade the imaging quality of spectral imagers,a numerical analysis model for the heat transfer in a CCD component was established by the finite element analysis method. According to the design feature and heat transfer path in the CCD component,the numerical simulation thermal analysis model of the CCD component was built by a finite element thermal analysis software IDEAS-TMG. Based on the given temperature boundary condition, the thermal analysis of CCD component on steady and transient states was carried out. The thermal response performance of CCD component, steady-state temperature profile and the transient temperature curves of key parts in the CCD component were given. The steady-state thermal analysis shows that the averaged temperature value of CCD device is 27.1 ℃ and the transient thermal analysis shows that the temperature rise coefficient is 2.5 ℃/min, and the highest temperature is 37.8℃. These results are coincident with the analysis results well,and verifies the correctness of numerical simulation and the validity of temperature prediction.Furthermore,the averaged temperature value and the temperature rise coefficient of CCD device on steady and tranisient tests are 26.8 ℃ and 2.4 ℃/min respectively, which demonstrates the results obtained can meet the requirements of heat control, and can supply theoretical warrants for the reliability and optimization of thermal design.