To solve the problem of practical light source lacking in silicon photonic integrated circuit, design and preparation method of integrated module including 1.55 μm InP FP laser chip, InP PIN photodetector chip and silicon optical waveguide was proposed. Silicon edge coupler of inverted cone type was fabricated by CMOS compatible process, and the coupling efficiency was 36.7 %. The laser chip and silicon waveguide chip were coupled by micro-assembly alignment technology, and the coupling efficiency was 35.8 % after UV adhesive curing. The 1 dB alignment tolerance was 1.2 μm horizontally and 0.95 μm longitudinally.