A soft-lithography based optical interconnection circuit for inter-chip communications on printed circuit board (PCB) was designed, fabricated and characterized. A novel circuit termination coupler was proposed, capable of easing the coupling between transceiver and waveguide significantly and reducing the demand for installing precision, and it was found that an optimum coupling was achieved at a ratio of 12∶1 between the lengths of beam duct and entrance/exit window. The fundamental circuit layout criteria were analyzed for waveguide intersections, and the crosstalks between crossed waveguides were calculated as a function of both various waveguide cross-sections and crossing angles. It was found that cross-talk would be lower than -30 dB for crossing angles greater than 54° in the case of strong bounding. Polymer devices for optical intercomnection circuit are fabricated experimentally. Experimental measurement for both coupling structure and cross-over circuit elements were compared with calculated results and a reasonably good agreement was obtained. In contrast with traditional lithography or laser direct writing, soft lithography features a simple fabrication process and high-precision duplication of polymer three-dimensional structure in quantity.