Simulation software was used to simulate the temperature distribution of the module and each component， and the simulation process of heat and the correctness of the simulation results were studied. Firstly， simulation software was used to analyze the heat dissipation of the module to obtain the temperature distribution of the module and each component. Then， the module was placed in a 25 ℃ incubator， and the temperature was measured of the random points on the surface of the module and OC by a multiple temperature detector. Finally， the simulated temperature was compared with the measured temperature， the temperature rise error value was calculated， and the difference between the measured value and the simulation value was compared through the temperature rise error value，to verify the correctness of the simulation results. By comparing and analyzing the experimental results and the simulation results， it was concluded that： when the module operated stably at the room temperature， there was little difference between the simulation value and the actual measured value， and the maximum temperature rise error was 3.5%， which was relatively small. The simulation results had theoretical reference and met the engineering design requirements.