Chinese Journal of Quantum Electronics, Volume. 40, Issue 6, 879(2023)

Simulation analysis of thermal effects of protective sampling panel for array target

ZHANG Kai1...2,3, TAN Fengfu2,3,*, HOU Zaihong2,3, HUANG Zhigang2,3, QIU Chenxiang2,3, ZHANG Silong2,3, and WU Yi1,23 |Show fewer author(s)
Author Affiliations
  • 1School of Environmental Science and Optoelectronic Technology, University of Science and Technology of China, Hefei 230026, China
  • 2Key Laboratory of Atmospheric Optics, Anhui Institute of Optics and Fine Mechanics, HFIPS, Chinese Academy of Sciences, Hefei 230031, China
  • 3Advanced Laser Technology Laboratory of Anhui Province, Hefei 230037, China
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    Detector array target is a common device for measuring the distribution of laser spot, and the sampling panel of array target needs higher damage resistance under long-term high-power laser irradiation. In order to improve the damage resistance of the sampling panel, based on the finite element analysis software Ansys Workbench, from the perspective of thermal design, the research compares the temperature field and thermal stress of the protective sampling panels with different thicknesses, different heat pipe arrangements and different interface heat transfer coefficients under long-term high-power laser irradiation. The analysis results show that after adding a cross heat pipe arrangement, the withstand peak power density of the sampling panel with a thickness of 6 mm increases from 1470.9 W·cm-2 to 3632.1 W·cm-2when the laser irradiation lasts for 120 s. This simulation analysis provides effective theoretical and data support for the design of protective sampling panel for array target.

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    Kai ZHANG, Fengfu TAN, Zaihong HOU, Zhigang HUANG, Chenxiang QIU, Silong ZHANG, Yi WU. Simulation analysis of thermal effects of protective sampling panel for array target[J]. Chinese Journal of Quantum Electronics, 2023, 40(6): 879

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    Paper Information

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    Received: Jan. 6, 2022

    Accepted: --

    Published Online: Dec. 22, 2023

    The Author Email: TAN Fengfu (tanfengfu@163.com)

    DOI:10.3969/j.issn.1007-5461.2023.06.008

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