In order to reduce the power consumption of the directly modulated electrical/optical conversion module, based on the analysis of the heat dissipation of the module, a packaging method is proposed to reduce the power consumption of the directly modulated electrical/optical conversion module. The traditional Kovar alloy material is used in the area sensitive to module deformation, and the diamond copper material with high thermal conductivity is used in the area requiring fast heat dissipation at the bottom of the semiconductor cooler(TEC). The simulation and test results show that the proposed method can reduce the temperature difference between the hot TEC end face and the bottom of the component, the temperature difference between the cold and hot TEC ends, the current of TEC and the power consumption generated by TEC itself. At the operating temperature of 70 ℃, the single-channel power consumption of the electrical/optical conversion module is reduced from 2.875 W in the traditional package to 1.25 W, which is a 56.5% reduction in power consumption.