International Journal of Extreme Manufacturing, Volume. 1, Issue 2, 25001(2019)
Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures
Three-dimensional (3D) electrically conductive micro/nanostructures are now a key component in a broad range of research and industry fields. In this work, a novel method is developed to realize metallic 3D micro/nanostructures with silver-thiol-acrylate composites via two-photon polymerization followed by femtosecond laser nanojoining. Complex 3D micro/nanoscale conductive structures have been successfully fabricated with ~200 nm resolution. The loading of silver nanowires (AgNWs) and joining of junctions successfully enhance the electrical conductivity of the composites from insulating to 92.9 Sm-1 at room temperature. Moreover, for the first time, a reversible switching to a higher conductivity is observed, up to ~105Sm-1 at 523 K. The temperature-dependent conductivity of the composite is analyzed following the variable range hopping and thermal activation models. The nanomaterial assembly and joining method demonstrated in this study pave a way towards a wide range of device applications, including 3D electronics, sensors, memristors, micro/nanoelectromechanical systems, and biomedical devices, etc.
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Ying Liu, Wei Xiong, Da Wei Li, Yao Lu, Xi Huang, Huan Liu, Li Sha Fan, Lan Jiang, Jean-Francois Silvain, Yong Feng Lu. Precise assembly and joining of silver nanowires in three dimensions for highly conductive composite structures[J]. International Journal of Extreme Manufacturing, 2019, 1(2): 25001
Received: Mar. 24, 2019
Accepted: --
Published Online: Jun. 4, 2020
The Author Email: Liu Ying (ylu2@unl.edu)