Infrared and Laser Engineering, Volume. 51, Issue 3, 20220104(2022)

Advances in mid-infrared integrated photonic sensing system (Invited)

Lipeng Xia1,2,3, Yuheng Liu1,2,3, Peiji Zhou1、*, and Yi Zou1
Author Affiliations
  • 1School of Information Science and Technology, ShanghaiTech University, Shanghai 201210, China
  • 2Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 201210, China
  • 3University of Chinese Academy of Sciences, Beijing 100049, China
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    In recent years, mid-infrared (wavelength range of 2–20 μm) integrated photonics has received a lot of attention for its potential applications, including absorption spectroscopy, thermal imaging, and free-space communication. The mid-infrared, which includes several atmospheric transparency windows, has an inherent advantage for sensing applications. The mid-infrared photonic devices also benefit from the mature technologies developed in the near-infrared for device design, test, and fabrication. In addition, integrated photonic sensors have demonstrated comparable sensitivity to their bulk counterparts, while featuring low power consumption, low cost, compact structure, and easy integration with other devices. Therefore, the mid-infrared integrated photonic sensors will play an important role in industrial detection, scientific research, medical diagnosis, military security, life, and other fields in the future. Here, Recent advances in the mid-infrared integrated photonic sensors have been reviewed. Three major components, sensing unit, spectrometer, and detector were discussed. An outlook for its future development was also proposed.

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    Lipeng Xia, Yuheng Liu, Peiji Zhou, Yi Zou. Advances in mid-infrared integrated photonic sensing system (Invited)[J]. Infrared and Laser Engineering, 2022, 51(3): 20220104

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    Paper Information

    Category: Special issue-Mid-infrared integrated optoelectronic technology

    Received: Jan. 20, 2022

    Accepted: Mar. 15, 2022

    Published Online: Apr. 8, 2022

    The Author Email: Zhou Peiji (zhoupj@shanghaitech.edu.cn)

    DOI:10.3788/IRLA20220104

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