The light quality of the pulsed semiconductor laser directly affects the detection accuracy. Aiming at the miniaturization requirement of laser detection system, a laser driving chip with small area and high integration was designed. The chip integrated the gate driving die and the power field effect transistor die using 3D stacked packaging technology, and added a double-side copper-clad ceramic substrate in the middle to realize the interconnection of the two dies. This packaging form not only improved the heat dissipation capability of the chip, but also enhanced the overcurrent capability. First, the current status of the laser detection transmitter module was introduced in detail, the design ideas and methods of the laser driver chip were introduced, and the specific packaging design process was given. Then, the gate driving circuit and layout were designed, and the gate driving chip was fabricated with a 0.25 μm BCD process. The multi-chip packaging scheme was designed. By setting up a peripheral circuit for testing to make the chip drive the 860 nm laser, the chip can output a narrow pulse with a pulse width of 180 ns, rise and fall times were less than 30 ns, and reached a peak current as high as 15 A when the chip power supply voltage was 12 V, the input level was 3.3 V and the frequency is 10 kHz PWM signal. It can make the laser emit light normally and meet the detection requirement. The chip has an ultra-small area about 5 mm×5 mm, which solves the problem of congestion in the internal space of the detection system caused by the traditional laser drive circuit using multi-chip modules, and provides a new idea for miniaturization.