Journal of Inorganic Materials, Volume. 35, Issue 7, 817(2020)

Creep Properties and Damage Mechanisms of 2D-SiCf/SiC Composites Prepared by CVI

Xi WANG1...2, Kejie WANG1, Hui BAI1, Zhuolin SONG1,2, Bo WANG3, and Chengyu ZHANG12,* |Show fewer author(s)
Author Affiliations
  • 1Science and Technology on Thermostructural Composite Materials Laboratory, Northwestern polytechnical University, Xi’an 710072, China
  • 2NPU-SAS Joint Research Center, Northwestern Polytechnical University, Xi’an 710072, China
  • 3School of Aeronautics, Northwestern polytechnical University, Xi’an 710072, China
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    The creep properties of 2D-SiCf/SiC composites prepared by chemical vapor infiltration were studied. The creep temperatures were 1200, 1300 and 1400 ℃, and the stress levels ranged from 100 MPa to 140 MPa. Scanning electron microscope was used to observe the fracture morphology, and their microstructure was analyzed by high resolution transmission electron microscope. The results show that the creep damage modes of 2D-SiCf/SiC composites mainly include the generation of matrix crack, interfacial debonding and fiber creep. The creep of bridging fibers leads to increase of the opening distance of the matrix cracks and further creep rupture of the composite. The microstructural stability of the SiC fiber plays a critical role in the creep properties of 2D-SiCf/SiC composites. SiC grains in the fibers of 2D-SiCf/SiC composites do not grow when it is crept at 1200 ℃/100 MPa. However, the grains grow significantly when the creep temperature increases to 1400 ℃. The creep rupture time decreases to 8.6 h from above 200 h, and the steady-state creep rate increases by three orders of magnitude.

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    Xi WANG, Kejie WANG, Hui BAI, Zhuolin SONG, Bo WANG, Chengyu ZHANG. Creep Properties and Damage Mechanisms of 2D-SiCf/SiC Composites Prepared by CVI[J]. Journal of Inorganic Materials, 2020, 35(7): 817

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    Paper Information

    Category: RESEARCH PAPER

    Received: Sep. 2, 2019

    Accepted: --

    Published Online: Mar. 3, 2021

    The Author Email: ZHANG Chengyu (cyzhang@nwpu.edu.cn)

    DOI:10.15541/jim20190450

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