Infrared imaging systems have been used in the military and civilian fields for many years, but have not been widely used, mainly due to their low resolution, high cost, unstable process and high technical threshold. Solving these problems requires improvements in sensor technology, detector packaging and infrared image processing chips. Infrared technology will develop in the future in the direction of low cost, dedicated processing chips and high resolution. At present, domestic manufacturers have successively launched new products such as wafer-level packaging, high-resolution detectors and dedicated image processing chips. However, there is no corresponding research on the infrared imaging system of these new devices. This article is mainly based on the practical application of Yantai IRay Technology Co., Ltd.′s new wafer-level packaged 1280×1024 infrared detector and the special image processing chip. The infrared imaging system is verified and analyzed in terms of system architecture, structural cooling and imaging algorithms.