Acta Photonica Sinica, Volume. 45, Issue 7, 70723003(2016)
Effect of Different Packaging of Phosphor on the Encapsulation Efficiency of Multi-chips LED
For the multi-chips LED packaged by phosphor layers, the light propagation in blue chip and phosphor layer was simulated based on the mathod of Monte Carlo. The influence of the encapsulation efficiency on different distrances between chip and phosphor layer was analyzed. The result shows that, the encapsulation efficiency of conformal coating firstly rises, then drops with the increasing of the diameter. The flat remote coating has a higher efficiency compared with others. The maximum encapsulation efficiency reaches up to 77.183% for the flat remote coating while the gap of chips is set as 0.2 mm and the distance between chip and phosphor layer is 0.28 mm. The influence of the curvature radius of phosphor layer on encapsulation efficiency is small.
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CAO Yan-ting, CHEN Chao, LIANG Pei, HUANG Jie. Effect of Different Packaging of Phosphor on the Encapsulation Efficiency of Multi-chips LED[J]. Acta Photonica Sinica, 2016, 45(7): 70723003
Received: Dec. 18, 2015
Accepted: --
Published Online: Aug. 18, 2016
The Author Email: Yan-ting CAO (cyt@cjlu.edu.cn)