Acta Optica Sinica, Volume. 38, Issue 9, 0912001(2018)

Measurement and Model Reconstruction of Topography of Sealing Plane Based on Digital Holography

Xiaobing Zhang* and Haijiang Liu*
Author Affiliations
  • School of Mechanical Engineering, Tongji University, Shanghai 201804, China
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    The measurement of surface topography is a prerequisite for studying the processing technology, processing quality and sealing performance of the sealing plane. In order to apply the digital holographic measurement technology to the on-line measurement of the sealing plane surface topography and to meet the requirements of visual display and three-dimensional (3D) model output of the measurement results in the industrial field, we propose a method of measuring surface morphology of sealing plane. The method combines digital holography with virtual manufacturing technology. Firstly, the surface topography of the sealing plane is measured based on digital holographic measurement technology and the measurement results are transformed into point cloud. Then, the 3D model is generated based on the point cloud. Finally, the accuracy of the measurement and model reconstruction is evaluated by the method of coordinating flatness with distance distribution between models. In addition, the proposed method can also indirectly measure the mating relationship between the topography of the sealing plane after assembly. The effectiveness of the proposed method is validated by the examples of a flange surface and the cylinder head surface of an engine block cylinder. The results show that the proposed method can quickly measure the topography of the sealing surface and output the results as a 3D model, which meets the needs of the industrial field for surface topography measurement.

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    Xiaobing Zhang, Haijiang Liu. Measurement and Model Reconstruction of Topography of Sealing Plane Based on Digital Holography[J]. Acta Optica Sinica, 2018, 38(9): 0912001

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    Paper Information

    Category: Instrumentation, Measurement and Metrology

    Received: Feb. 26, 2018

    Accepted: Apr. 8, 2018

    Published Online: May. 9, 2019

    The Author Email:

    DOI:10.3788/AOS201838.0912001

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