Electro-Optic Technology Application, Volume. 26, Issue 4, 49(2011)

Analysis of Aluminum Back-Surface Field Passivation Technique by PC1D

YAN Li and GAO Hua
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  • [in Chinese]
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    In order to reduce the cost of silicon raw materials,thinner silicon wafers are used for crystalline silicon solar cells. Aluminum back-surface field passivation technique is more important for thinner solar cells PC1D method is used to model the aluminum back-surface field passivation technique of p-type monocrystalline silicon substrate 125×125 solar cells. The model results are analyzed. For a certain thickness solar cells,especially when the minority carrier diffusion length is greater than the thickness of silicon wafers,the back-surface recombination velocity is particularly important for efficiency. The efficiency will be increased with the increase of aluminum back-surface field junction depth,the decrease of back-surface recombination velocity and the increase of minority carrier lifetime. Aluminum back-surface field can improve the quality of the back-surface passivation,reduce the back-surface recombination velocity thus improve the efficiency of solar cells,which is commonly used for the commercial crystalline silicon solar cells.

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    YAN Li, GAO Hua. Analysis of Aluminum Back-Surface Field Passivation Technique by PC1D[J]. Electro-Optic Technology Application, 2011, 26(4): 49

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    Paper Information

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    Received: Jun. 22, 2011

    Accepted: --

    Published Online: Sep. 9, 2011

    The Author Email:

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    CSTR:32186.14.

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