With the demand of from space technology for a large field of view and higher resolution, the scale of line infrared detectors is increasing. Single point coupling mode fails to meet the temperature uniformity requirement of long linear infrared detector chips. This study compares and analyzes various types of flexible thermal links, based on the design and the testing outcomes from many domestic and international research institutes. The characteristics and applicability of the various flexible thermal link designs, in terms of thermal and mechanical properties, are summarized.