Electronics Optics & Control, Volume. 29, Issue 2, 82(2022)

Optical Interconnection for Airborne Integrated Modular Processor Platform

ZHAN Wentao... YANG Liu and WANG Xiaobo |Show fewer author(s)
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    In avionics systems, there are two configurations of airborne integrated modular processor platform: one is LRM configured in a centralized cabin and the other is ARINC600 LRU installed on a bracket.As for the two configurations, their characteristics are described respectively.Based on the status quo of airborne optical interconnection technology, its engineering realization modes of optical-electric transformation and high-density interface transmission are introduced.The verification results of current optical interconnection methods are described, and then the direction of future improvement is discussed.

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    ZHAN Wentao, YANG Liu, WANG Xiaobo. Optical Interconnection for Airborne Integrated Modular Processor Platform[J]. Electronics Optics & Control, 2022, 29(2): 82

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    Paper Information

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    Received: Jan. 24, 2021

    Accepted: --

    Published Online: Mar. 4, 2022

    The Author Email:

    DOI:10.3969/j.issn.1671-637x.2022.02.018

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