Electronics Optics & Control, Volume. 29, Issue 2, 82(2022)
Optical Interconnection for Airborne Integrated Modular Processor Platform
In avionics systems, there are two configurations of airborne integrated modular processor platform: one is LRM configured in a centralized cabin and the other is ARINC600 LRU installed on a bracket.As for the two configurations, their characteristics are described respectively.Based on the status quo of airborne optical interconnection technology, its engineering realization modes of optical-electric transformation and high-density interface transmission are introduced.The verification results of current optical interconnection methods are described, and then the direction of future improvement is discussed.
Get Citation
Copy Citation Text
ZHAN Wentao, YANG Liu, WANG Xiaobo. Optical Interconnection for Airborne Integrated Modular Processor Platform[J]. Electronics Optics & Control, 2022, 29(2): 82
Category:
Received: Jan. 24, 2021
Accepted: --
Published Online: Mar. 4, 2022
The Author Email: