A water-assisted femtosecond laser silicon carbide micro-hole machining method is proposed， and a 200 μm diameter micro-hole is processed on a 350 μm thick silicon carbide sample. The difference between processing micro-holes in air and water-assisted processing of micro-holes is discussed. Water reduces the temperature of the processing area， greatly reducing the occurrence of oxidation reactions. The debris produced by processing is taken away by the water， avoiding the formation of HAZ and reducing the roughness of the sample. The processed micro-holes have smooth sidewalls and no HAZ， which has practical application value in industry. The processing method makes it a reality to process silicon carbide micropores with good morphology， and is expected to be applied to the industrial processing of silicon carbide.