We make test and comparison for the photoelectricity and thermal parameter of light emitting diode (LED) different substrates like glass, ceramic and find that luminous flux of glass substrate chip on board (COB) packaging is very close to that of ceramic substrate. We design two heat dissipation methods: the layer with silver brushed on back and aluminum slot model both improve heat- conducting property of glass substrate COB. When the thickness of silver reaches to 75 μm and light becomes stable, the temperature of light emitting diode rubber surface is 91.5 ℃, thus better heat dissipation and glowing effect has been reached.