Microelectronics, Volume. 52, Issue 6, 1090(2022)
A Low-Overhead On-Chip Aging Measurement Scheme for Bypass Reconfiguration RO
The reliability problems caused by chip aging are becoming more and more serious, which continuously reduce the performance of the chip and may eventually lead to the failure of the chip. This paper presents a low-overhead aging measurement scheme of bypass reconfiguration Oscillating Ring (RO). The experimental results show that, compared with the existing schemes, the hardware overhead of the scheme is reduced by 63.2%, the performance is improved by 15.7%, and the aging online measurement error is as small as 2%.
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MA Junxiang, LIANG Huaguo, LI Danqing, YI Maoxiang, LU Yingchun, JIANG Cuiyun. A Low-Overhead On-Chip Aging Measurement Scheme for Bypass Reconfiguration RO[J]. Microelectronics, 2022, 52(6): 1090
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Received: Dec. 22, 2021
Accepted: --
Published Online: Mar. 11, 2023
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