A novel optimization for packaging high-speed photodiodes is presented. All the packaging parasitics and the intrinsic characteristic parameters of the photodiode chip are accurately measured with microwave network analyzer. The resonance among them is investigated. The resonance is utilized to significantly improve the frequency response of the devices. Both theoretical and experimental results show that the packaged photodiodes can have a 3 dB bandwidth which is broader than that of the photodiode chip. This method, which utilizes the parasitic inductance of necessary bonding wires, can be used to improve the frequency response of optoelectronics devices without any additional component, only by using parasitic inductance induced by gold wire which is essential in packing process of optoelectronic devices.