In order to reduce the temperature of the active region of the microdisk cavity semiconductor laser and improve the reliability of the package, the thermal characteristics of limacon microdisk cavity semiconductor lasers packaged with AlN, WCu10, SiC, graphene and CVD diamond transition heat sink respectively were analyzed with Ansys Workbench, and the temperature distribution, thermal stress and thermal strain distribution of the device were obtained. The results show that the active region temperature of SiC package is 2.18 and 3.078℃ lower than that of AlN and WCu10 package respectively, and it shows the lowest thermal stress and minimum thermal strain in the five kinds of transition heat sink packaging devices. SiC packaging can not only effectively reduce the temperature of the active region, but also can reduce the package stress and device strain, so as to improve the reliability and heat dissipation ability of the device. Theoretical calculation results have guiding significance for single tube heat dissipation and array integrated heat dissipation of semiconductor lasers.