Infrared Technology, Volume. 45, Issue 3, 276(2023)

Simulation of Infrared 3D Image Reconstruction of High Voltage Switchgear Temperature Field Based on Lazy Snapping Hybrid Simulated Annealing Algorithm

Jie WANG1、*, Hong WU2, Zhongqiang ZHAN1, Jinliang LI1, Ming JIN1, and Wentao CHEN1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    A simulation method for the infrared three-dimensional (3D) image reconstruction of a high-voltage switchgear temperature field based on a lazy snapping hybrid simulated annealing algorithm is proposed to improve the simulation effect of the high-voltage switchgear temperature field. In this method, the active infrared image sensor was used to collect an infrared image of the temperature field of a high-voltage switchgear, and the square-graph nonlinear stretching algorithm was used to enhance it. Subsequently, the enhanced infrared image was segmented by lazy snapping algorithm, and the two-dimensional texture flow-field image was synthesized by a hybrid genetic simulated annealing algorithm. Based on the image, an image quilting texture synthesis algorithm was used to synthesize the 3D image of the high-voltage switchgear temperature field, and the infrared 3D image reconstruction simulation process of the temperature field was completed. The experimental results demonstrated that this method effectively enhanced the infrared image of the temperature field of a high-voltage switchgear, and the intersection and union ratio of the segmented infrared image had a value that was approximately 1.0. The 3D image was effectively generated according to the generated two-dimensional texture flow-field image, and the maximum deviation of the temperature field simulation value was only 0.03℃.

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    WANG Jie, WU Hong, ZHAN Zhongqiang, LI Jinliang, JIN Ming, CHEN Wentao. Simulation of Infrared 3D Image Reconstruction of High Voltage Switchgear Temperature Field Based on Lazy Snapping Hybrid Simulated Annealing Algorithm[J]. Infrared Technology, 2023, 45(3): 276

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    Paper Information

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    Received: Mar. 17, 2022

    Accepted: --

    Published Online: Apr. 7, 2023

    The Author Email: Jie WANG (yeji000558@163.com)

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