Aiming at the problems of large number of channels, large volume and power consumption and low integration of traditional microwave photonic products, an ultra-compact package optical/electrical conversion array module based on microwave photonic hybrid integrated packaging technology is designed. The photonic device, microwave chip, adjustable attenuation chip and circuit system are sealed into a shell. It can realize many functions such as optical/electrical conversion, signal amplification, attenuation adjustable and equalization in ultra-compact space. The test results show that the photoelectric responsiveness of the module is higher than 0.8 A/W in the 2~18 GHz band. The mean value of S21 for the six channels is -3.5 dB, the flatness of each channel is within ±1.5 dB, the channel isolation is greater than 55 dB, and the standing wave reflection is less than 1.7 dB.