Acta Optica Sinica, Volume. 39, Issue 8, 0816003(2019)

Microstructure and Optical Properties of c-AlN/TiN/Si(100) Heterostructure

Guotao Lin, Zukang Mo, Yao Weng, Yuechun Fu*, Huan He, and Xiaoming Shen
Author Affiliations
  • School of Resources, Environment and Materials, Guangxi University, Center of Collaborative Innovation for Ecological Aluminum Industry in Guangxi, Guangxi Key Laboratory of Processing for Non-Ferrous Metallic and Featured Materials, Nanning, Guangxi 530004, China
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    Owing to its excellent properties, cubic aluminum nitride (c-AlN) is an ideal material for optoelectronic devices such as light-emitting diodes and laser diodes. In this study, the c-AlN/TiN/Si(100) heterostructure is deposited using the laser molecular beam epitaxy technique, and its microstructure and optical properties are investigated. The experimental results show that the AlN film and the TiN buffer layer both show a (200) preferred orientation of cubic rock-salt structure. The interfaces between the c-AlN film, TiN buffer layer, and Si substrate are clear; a second phase is not observed. However, there are certain defects at the interface owing to mismatched stress. The photoluminescence spectrum of c-AlN film exhibits three emission peaks at approximately 376, 520, and 750 nm. The emission peak at 376 nm is related to nitrogen vacancy (VN) and oxygen impurity (ON). The emission peak at 520 nm is related to the recombination of Al vacancies (VAl) and ON. The emission peak at 750 nm can be attributed to the radiation recombination between VAl and the valence band. The electroluminescence emission peak of c-AlN film is approximately at 580 nm, and it is attributed to a deep-level defect emission.

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    Guotao Lin, Zukang Mo, Yao Weng, Yuechun Fu, Huan He, Xiaoming Shen. Microstructure and Optical Properties of c-AlN/TiN/Si(100) Heterostructure[J]. Acta Optica Sinica, 2019, 39(8): 0816003

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    Paper Information

    Category: Materials

    Received: Mar. 12, 2019

    Accepted: May. 5, 2019

    Published Online: Aug. 7, 2019

    The Author Email:

    DOI:10.3788/AOS201939.0816003

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