Wire wedge bonding is a kind of technology which realizes the connecting of chip and circuit through the synergistic action of ultrasonic vibration and bonding force. Today, this lead bonding technology is one of the most important and widely used technologies in the field of microelectronics packaging. The quality of wire bonding interconnect is an important factor affecting the reliability and trustworthiness of infrared detector components. In this paper, based on infrared detector module, the multi-dimensional influencing factors of gold wire wedge bonding strength are explored. Starting with the influence of bonding pad quality and the shape of gold wire wedge welding spot on bonding strength, the influence of ultrasonic power, bonding pressure and bonding time on the gold wire wedge bonding strength is studied. According to the principle and process of gold wire wedge welding, the infrared detector component is selected to conduct the strength influence test and analysis, which can guide the actual gold wire wedge welding process. And the uniformity of gold wire bond tensile force under the best process parameters is explored, which verifies the consistency of gold wire wedge bond strength process.