To further improve the energy transfer efficiency of the semiconductor laser shaping system, a semiconductor laser shaping system based on hyperbola substrate microlens array is proposed. Semiconductor laser beam collimation and splitting can be simultaneously achieved by this microlens array, as a result the number of optical surface is reduced. Slow axis collimated lens of semiconductor laser is designed with the use of telecentric optical path so as to meet the small field requirement of microlens. With the simulation result in ZEMAX, the feasibility of the semiconductor laser shaping system based on hyperbola substrate microlens array is verified. A 30 mm×15 mm irradiance area is obtained with the unhomogeneity of less than 7%, and the energy transfer efficiency of the system reaches 96%.