NUCLEAR TECHNIQUES, Volume. 46, Issue 8, 080007(2023)

Development and application of a radiation effect evaluation method of aerospace integrated circuits for radiation hardened by design

Hongchao ZHENG1,2, Liang WANG1,2, Zhe LI1,2, Gang GUO3, and Yuanfu ZHAO1,2、*
Author Affiliations
  • 1Beijing Microelectronics Technology Institute, Beijing 100076, China
  • 2Laboratory of Science and Technology on Radiation-Hardened Integrated Circuits, China Aerospace Science and Technology Corporation, Beijing 100076, China
  • 3Institute of Nuclear Physics, China Institute of Atomic Energy, Beijing 102413, China
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    Aerospace integrated circuits represent core components of space electronic systems, and anti-radiation hardening is a key technology to ensure the reliable operation of aerospace integrated circuits in the space domain. As the feature sizes of integrated circuits shrink to the nanometer scale, the single-event effect gradually becomes the most critical factor limiting the radiation-hardened performance level of aerospace integrated circuits. In this study, radiation hardened by design is utilized as a method to develop radiation-hardened performance. Based on single-event radiation tests on a heavy ion accelerator, new methods are proposed for the single-event test evaluation of new processes and devices. Consequently, new technique development and radiation effect law research are also undertaken. The effectiveness of the design hardening technology is evaluated, and a single-event radiation damage mechanism is discovered. The proposed technology provides key support for the production of high-reliability and long-lifetime aerospace integrated circuit products.

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    Hongchao ZHENG, Liang WANG, Zhe LI, Gang GUO, Yuanfu ZHAO. Development and application of a radiation effect evaluation method of aerospace integrated circuits for radiation hardened by design[J]. NUCLEAR TECHNIQUES, 2023, 46(8): 080007

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    Paper Information

    Category: Research Articles

    Received: Jun. 5, 2023

    Accepted: --

    Published Online: Sep. 19, 2023

    The Author Email:

    DOI:10.11889/j.0253-3219.2023.hjs.46.080007

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