The readout circuit wafer test of digital infrared detectors is an important part of wafer evaluation. Based on the existing probe test equipment, a circuit board device has been developed, which can drive the wafer to work and convert different forms of digital output signals into a unified digital image transmission format. During the test process, the circuit board parameters can be set. Firstly, the infrared detector readout wafer test system was introduced, then the principle of the developed test circuit board device was analyzed. Finally, the hardware implementation of this circuit board was carried out, and an internal test program was written to complete functional verification. Two forms of wafers, differential output and single channel output, were tested and the results were consistent with those obtained at low temperatures, indicating accuracy and reliability. In addition, the circuit device has 100 input interfaces, which can be reprogrammed and supports testing of digital wafers with output bit widths of 24 bits and below, making the test system more compatible and flexible.