Chinese Journal of Lasers, Volume. 47, Issue 5, 0500011(2020)

Laser Hole Drilling on Surface of Electronic Ceramic Substrates

Xuesong Mei1, Zixuan Yang1, and Wanqin Zhao1,2、*
Author Affiliations
  • 1State Key Laboratory for Manufacturing System Engineering, Xi'an Jiaotong University,Xi'an, Shaanxi 710049, China
  • 2School of Materials Engineering, Shanghai University of Engineering Science, Shanghai 201620, China
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    Millisecond and nanosecond lasers have become the preferred processing tools for alumina and aluminum nitride ceramics owing to the lasers' unique advantages of high reliability, high efficiency, low cost, and ability to process hard, brittle, and difficult-to-machine materials. These lasers play an irreplaceable role in the industrialized processing of group holes on ceramic substrate surfaces. This paper introduces the removal mechanisms with respect to laser processing ceramic materials of electronic substrates, including material ablation threshold, photothermal effect, and photochemical effect. The effects of the lasers' processing parameters and ambient environments on the hole size of ceramic materials, such as diameter, depth, and taper, are discussed. Current problems in the industrial application of laser hole drilling to ceramic substrates are summarized, and future development trends are presented.

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    Xuesong Mei, Zixuan Yang, Wanqin Zhao. Laser Hole Drilling on Surface of Electronic Ceramic Substrates[J]. Chinese Journal of Lasers, 2020, 47(5): 0500011

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    Paper Information

    Category: reviews

    Received: Jan. 18, 2020

    Accepted: Feb. 26, 2020

    Published Online: May. 12, 2020

    The Author Email: Zhao Wanqin (linazhaolinazhao@foxmail.com)

    DOI:10.3788/CJL202047.0500011

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